Dongguan Xingqiang Circuit Board Technology Co., Ltd.

Dongguan Xingqiang Circuit Board Technology Co., Ltd.

Manufacturer from China
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2 Years
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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules

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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:Missalice
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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules

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Brand Name :High Density PCB
Place Of Origin :China
Model Number :Varies by goods condition
Certification :ISO 9001 / RoHS /UL / IATF 16949 (automotive)
MOQ :Sample,1 pc(5 square meters)
Price :Gerber Files or BOM List
Payment Terms :T/T,Western Union
Supply Ability :100000㎡/Month
Delivery Time :NA
PCB Type :Custom High Density PCB
High-Tg FR-4 :Yes
Min Line Spacing :3Mil
Impedance Control :±10%
DFM Review :Support
Board Thickness :0.2-5.0mm
Layer Count :1-30 Layers
Board Size :As Your Request
Surface Finish :HASL, ENIG, OSP
Hole Size Tolerance :PTH ±0.075, NTPH ±0.05
Product Features :High Density,Low-Dk Substrate,Moisture Proof
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What can we do?:

We offer custom high-density HD PCBs.Built with fine traces, laser microvias, and multilayer designs, they support device miniaturization and high-speed signal integrity. Available with ENIG/OSP/HASL surface finishes, impedance control, and reliable FR‑4 or low-loss substrates. All PCBs are IPC compliant, anti-static vacuum packed, and fully tailored to your Gerber, layer count, and performance specifications.

Custom PCB vs. Off-the-Shelf PCB:


Comparison Item Custom High-Density PCBs Off-the-Shelf (Standard) PCBs
Design Flexibility Fully customized to your exact dimensions, layer count, and component layout; supports HDI/microvia/miniaturization Fixed size, layout, and features; limited to standard specifications
Performance Matching Optimized for high-speed, impedance control, low loss, or RF/5G applications Generic performance; hard to meet high-frequency or specialized signal needs
Device Integration Enables compact, slim form factors for wearables, IoT, and portable electronics Bulky standard outlines; poor fit for miniaturized products
Material & Surface Finish Choice of FR‑4, high-Tg, or low-loss substrates; ENIG/OSP/HASL selectable Predefined materials and finishes; no customization
Quality & Compliance Built to IPC Class 2, RoHS, UL per project requirements Limited certification options; inconsistent quality
Long-Term Cost Higher upfront tooling, lower assembly and maintenance costs Lower initial cost; higher retrofitting and compatibility costs
Scalability Scalable from prototypes to mass production with consistent quality Limited scalability; frequent design compromises


Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules

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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules


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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules


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Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules



Custom Multi Layer High Density PCB Board Low Loss For Wireless Communication Modules

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