2 Layers Flexible Printed Circuit Board (FPC) for Medical Enquipment
A Flexible Printed Circuit Board (FPC), also known as a flexible circuit, is a specialized type of printed circuit board constructed from flexible, bendable insulating substrates. Unlike rigid PCBs (RPCBs) that rely on inflexible materials like fiberglass-reinforced epoxy (FR-4), FPCs leverage malleable substrates to enable dynamic shaping, folding, or rolling—making them ideal for electronic devices where space constraints, weight reduction, or mechanical flexibility are critical.
Features:
- Product Name: Flexible PCB Board
- Size: Customized
- Application: Electronic Devices, Medical Equipment, Automotive Industry
- Mini Line Width: 0.075mm
- Standard: IPC Standard
- Layer Count: 2-30 layer
Technical Parameters:
| Technical Parameter |
Specification |
| Dimension |
customized |
| Insulation Materials |
Organic Resin |
| Board Type |
Flexiable PCB |
| Service |
One Stop Turnkey Service |
| Flexibility |
Highly Flexible |
| Application |
Electronic Devices, Medical Equipment, Automotive Industry |
| Mini Line Width |
0.075mm |
| Surface Treatment |
OSP |
| Process |
Immersion Gold |
| Legend Color |
White |
Applications:
- Consumer Electronics:Smartphones (display/touchscreen connections, camera modules), tablets, laptops (keyboard/trackpad links), smartwatches, earbuds, and gaming controllers.
- Automotive Electronics:Infotainment systems, dashboard displays, LED lighting, sensor connections (e.g., for ADAS—Advanced Driver Assistance Systems), and battery management systems (BMS).
- Medical Devices:Flexible endoscopes, wearable health monitors (e.g., heart rate sensors), implantable devices (e.g., pacemakers), and diagnostic equipment (e.g., ultrasound probes).
- Aerospace & Defense:Satellite components, avionics (e.g., cockpit displays), and military gear (where vibration resistance and compactness are critical).
- Industrial Equipment:Robotic arms (flexible connections for moving parts), industrial sensors, and control panels.
Future Trends•
High-Density Interconnects (HDIs):Smaller vias and finer trace widths (down to 25μm) to support more complex circuits in tiny spaces.• Eco-Friendly Materials:Development of recyclable or biodegradable substrates to reduce environmental impact.• Integration with Sensors:Embedding flexible sensors (e.g., pressure, temperature) directly into FPCs for smart textiles, medical wearables, and IoT devices.• 5G & High-Speed Signals:Optimized FPC designs to minimize signal loss for 5G-enabled devices and high-frequency applications (e.g., radar systems). 
