Rigid-Flex PCB
The flex-rigid board combines the structural stability of rigid substrates with the bending flexibility of flexible materials, suiting 3D assembly in tight spaces. It boasts excellent insulation and temperature resistance, withstands repeated mechanical stress, and ensures stable circuitry. Widely used in smart devices, automotive electronics, etc., it aids lightweight and highly reliable device designs.
Advantages of Rigid-Flex PCB:
- Optimize space and size
- Reduce the use of connectors and cables
- Adapt to complex spatial layout
- High temperature resistance and chemical resistance
Product Features:
- Combines rigid stability and flexible bending for tight spaces
- stress; stable circuitry
- Enables lightweight, high-reliability devices
- Design flexibility
Manufacturing process:
- Design and Material Selection: During the design phase, rigid and flexible segments are defined. Appropriate base materials (e.g., FR4, polyimide) and processes are selected to ensure seamless integration of rigid and flexible sections.
- PCB Lamination: Rigid-flex PCB fabrication involves lamination of rigid and flexible components, typically via precision hot pressing and bonding to integrate multi-material circuit layers into a unified structure.
- Etching and Hole Machining: The laminated substrate undergoes photolithography and etching to form target circuit patterns, with hole machining performed for component mounting and interlayer interconnection.
- Surface Finishing: Surface treatment processes (e.g., gold plating, tin plating, OSP) are applied to protect circuit surfaces, ensuring superior solderability and oxidation resistance.
- Assembly and Testing: Post-fabrication, the board undergoes component mounting or through-hole soldering, followed by electrical testing to verify proper circuit functionality and compliance with design specifications.
