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4-layer HASL rigid-flex PCB
1.Product Description:
The 4-layer lead-free HASL (Hot Air Solder Leveling) flex-rigid PCB merges structural adaptability with robust solder performance, engineered for reliable operation in demanding electronic systems.Constructed with a 4-layer configuration, it integrates rigid FR-4 substrates for mechanical robustness and flexible polyimide (PI) layers for superior bending capability, enabling seamless 3D integration in compact assemblies. Its standout feature is the lead-free HAL surface finish—a RoHS-compliant process that deposits a uniform tin-lead alloy (or tin-silver-copper for lead-free variants) via hot air leveling, ensuring excellent solderability, enhanced wear resistance, and strong adhesion to copper traces.
2.Product Features:
| Application Field | Typical Usage Scenarios | Core Adaptation Advantages |
|---|---|---|
| Smart Wearables | Screen-mainboard connection for smart watches/bracelets, internal wiring of earbud charging cases | Thin and light (total thickness down to 0.2mm), bend-resistant, space-saving |
| Industrial Control | Robot joint sensors, internal connection of PLC controllers | Vibration-resistant (vibration frequency: 10-2000Hz), high and low temperature resistant |
| Medical Devices | Portable ultrasound probes, blood glucose meter circuit boards | Biocompatibility (medical-grade PI), high-precision wiring |
| Automotive Electronics | In-vehicle cameras, millimeter-wave radar circuit boards | Humidity and heat resistant (85℃/85%RH for 1000h), electromagnetic interference resistant |
4.FAQ about PCB 4-layer HASL rigid-flex PCB