Gold Plated Flexible Rigid PCB Board 4 Layer FR4 Circuit Board OEM Service

4-layer gold-plated flexible-rigid PCB

Product Description:

Our Rigid-Flex PCB (Rigid-Flex Printed Circuit Board) combines the durability of rigid boards with the flexibility of flexible circuits, offering an ideal solution for compact, high-performance

electronic devices. Engine timed for space-constrained and high-reliability applications, this hybrid circuit board is widely used in aerospace, medical devices, military equipment, automotive

electronics, and advanced consumer electronics.

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Advantages of Rigid-Flex PCB:

• Space-Saving Design – Eliminates the need for connectors and cables, reducing overall assembly size and weight.
• Enhanced Reliability – Fewer interconnections mean lower risk of connection failure and improved signal integrity.
• Superior Durability – Resistant to vibration, shock, and extreme temperatures, perfect for harsh environments.
• Flexible Configuration – Customizable layer count (e.g., 4-layer, 6-layer, 8-layer), materials (FR-4), and bend radius to meet your design needs.

• High-Density Interconnect (HDI) – Supports micro-vias, blind/buried vias for complex circuit integration.
• RoHS & CE Compliant – Environmentally friendly and meets international safety standards.

Why Choose Us?
✔ 30 Years Expertise in Rigid-Flex PCB Manufacturing
✔ ISO 9001, ROHS, and ISO /TS16949 Certified
✔ Support customized services
✔ Professional Engineering Support (DFM, impedance simulation)
✔ Global Shipping (DHL, FedEx, UPS) – Delivered to USA, Germany, UK, Japan, Australia, etc.

Manufacturing process:

• Design and material selection: During the design phase, it is necessary to clarify which parts need to be rigid and which parts need to be flexible. App base materials (such as FR4, polyimide) and processes should be selected to ensure good integration of rigid and flexible parts..
• PCB lamination: The manufacturing of rigid-flex PCBs requires the lamination of rigid and flexible parts, which usually involves precise hot pressing and bonding to combine different material circuit layers into a complete PCB.
• Etching and hole processing: Photolithography and etching are performed on the laminated PCB to form the desired circuit pattern, and hole processing is out for component mounting and interconnection between different circuit layers.
• Surface treatment: Surface treatment processes (such as gold plating, tin HASL, OSP, etc.) are used to protect the surface of the circuit, ensuring its good solderability and anti-oxidation capability.
• Assembly and testing: After completing the circuit board, perform component placement or plug-in welding, and conduct electrical testing to ensure that the circuit functions normally and the design requirements.