High temperature resistant OSP black oil double panel PCB
Product Description
High temperature resistant OSP black oil double panel PCB is a double-sided printed circuit board integrating high temperature resistant performance, OSP (Organic Solderability Preservative) surface treatment, and a black solder mask. It adopts a double-sided wiring design: the substrate is made of high temperature resistant materials (such as high Tg FR-4), and the surface is coated with black ink as the solder mask, which provides insulation, protects the circuit, and offers good light-shielding properties. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for circuits operating in high temperature environments (typically above 130℃) and adapts to the welding needs of conventional and precision components.
Core Characteristics
- High temperature resistance + OSP treatment + black oil solder mask combination: The high temperature resistant substrate ensures stable performance under high heat; the ultra-thin (0.1-0.3μm) OSP film guarantees oxidation resistance and solderability; the black ink provides stable insulation, excellent light-shielding, and a professional appearance.
- Double-sided structure: Supports bidirectional signal transmission, meeting the layout requirements of electronic devices working in high temperature environments and small to medium-scale circuit design needs.
- Strong compatibility: The OSP process, high temperature resistant substrate, and black solder mask ink work well together, integrating smoothly into conventional production processes.
Main Advantages
- Excellent high temperature stability: The high temperature resistant substrate and heat-resistant black ink allow the PCB to maintain structural and performance integrity in high temperature operating environments, suitable for fields like automotive electronics and industrial control.
- Reliable solderability: The OSP film is easily removed during soldering, enabling good solder wetting on copper surfaces, reducing cold solder joint risks, and ensuring stable connections even for fine-pitch components, even after exposure to high temperatures.
- Superior light-shielding and protection: The black solder mask provides effective light-shielding, preventing light interference in sensitive circuits; it also isolates circuits from external environments, enhancing corrosion and abrasion resistance.
- Cost-effectiveness: Combining the low-cost OSP process with economical black ink and high temperature resistant materials (compared to some advanced high temperature substrates), the PCB has relatively controllable production costs.
- Environmental friendliness: The OSP process uses non-toxic organic compounds, and the black ink is generally environmentally friendly, complying with environmental regulations and reducing hazardous waste.
- Dimensional precision: The thin OSP layer and black ink do not significantly affect the board’s thickness or flatness, making it suitable for high-density circuit designs in high temperature applications requiring precise dimensions.
