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Drone Circuit Board
Drone circuit boards are circuit substrates installed in electronic components such as flight control systems, image transmission systems, electronic speed controllers, power distribution modules (PDB), GPS modules, sensors, communication modules, and cameras. They are responsible for functions such as signal processing, power conversion, and communication control.
Structural and Material Characteristics:
Features:
| Item | Consumer Drone | Industrial Drone | Military/Special Drone |
|---|---|---|---|
| Board material | Ordinary FR-4 | High TG FR-4 / PI | PTFE / Ceramic substrate / Rogers |
| Number of layers | 4~6 layers | 6~10 layers | 8~16 layers + HDI + blind and buried vias |
| Copper thickness | 1oz | 2~3oz | ≥3oz (high-power modules) |
| Surface treatment | OSP/Immersion Gold | Immersion Gold/Hot Air Solder Leveling/Anti-sulfurization Process | Immersion Gold/Immersion Silver/Three-proof Coating |
| Anti-interference ability | Medium | High | Extremely high (EMI/EMC reinforced design) |
| Applicable temperature range | 0~70℃ | -20~85℃ | -40~125℃ or higher |
| Communication functions | Bluetooth/WiFi/Image transmission, etc. | 4G/5G/Data transmission/RTK GPS | Encrypted communication/Radar/Electronic countermeasure links |