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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

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City:dongguan

Province/State:guangdong

Country/Region:china

Contact Person:MrsHuang

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FR4 Material Black Oil Drone Circuit Board PCB With ENIG Surface Treatment

Name: FR4 Material Black Oil Drone Circuit Board PCB With ENIG Surface Treatment
Brand: UAV PCB
Price: 1 USD

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Brand Name :UAV PCB

Place Of Origin :China

MOQ :5 square meters

Payment Terms :T/T,Western Union

Supply Ability :10000㎡

Delivery Time :15-20 Working Day

Model Number :Varies by goods condition

Certification :ROHS,CE

Price :NA

Min. Hole Size :0.1mm

Min. Solder Mask Bridge :0.08mm

Material :FR-4

Copper Thickness :0.5-5.0oz

Silkscreen Color :White, Black, Yellow

Solder Mask Color :Green, Red, Blue, Black, White

Min. Silkscreen Clearance :0.15mm

Surface Finish :HASL, ENIG, OSP, Immersion Silver, Immersion Tin

Min. Line Width/Spacing :3mil

Max. Panel Size :528mm x 600mm

Layer Count :2-30 layers

Board Thickness :0.2-5.0mm

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Black oil Drone Circuit Board

Drone circuit boards are circuit substrates installed in electronic components such as flight control systems, image transmission systems, electronic speed controllers, power distribution modules (PDB), GPS modules, sensors, communication modules, and cameras. They are responsible for functions such as signal processing, power conversion, and communication control.

Structural and Material Characteristics:

Thickness: Common thickness is 0.8mm ~ 1.6mm.
Copper thickness: 1oz ~ 3oz, and thickened copper layers are often used in parts such as electronic speed controllers and power distribution.
Surface treatment: ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), etc.
Materials: FR-4 is commonly used, and some high-end applications adopt polyimide (PI) or ceramic substrates to improve shock resistance and high-frequency characteristics.

Features:

The board is required to be thin and light, and the components are arranged compactly to reduce the total weight of the drone.
Adapt to the vibration environment during high-speed rotation and flight and outdoor temperature changes.
Multi-functional modules are integrated into one main board (such as the integration of flight control and PDB), reducing volume and weight.
Measures such as ground layer separation, filter wiring, and signal impedance control are adopted to reduce electromagnetic interference.

Special Processes:

HDI (High-Density Interconnect) board technology
Rigid-flex board (used in foldable arm drones)
High-frequency and high-speed materials (used for high-frequency signal transmission such as 5.8GHz image transmission and radar waves)

Item	Consumer Drone	Industrial Drone	Military/Special Drone
Board material	Ordinary FR-4	High TG FR-4 / PI	PTFE / Ceramic substrate / Rogers
Number of layers	4~8 layers	6~12 layers	8~20 layers + HDI + blind and buried vias
Copper thickness	1~2oz	2~3oz	≥4oz (high-power modules)
Surface treatment	OSP/Deposit of gold	Immersion Gold/Hot Air Solder Leveling/Anti-sulfurization Process	Immersion Gold/Immersion Silver/Three-proof Coating
Anti-interference ability	Medium	High	Extremely high (EMI/EMC reinforced design)
Applicable temperature range	0~70℃	-20~85℃	-40~125℃ or higher
Communication functions	Bluetooth/WiFi/Image transmission, etc.	4G/5G/Data transmission/RTK GPS	Encrypted communication/Radar/Electronic countermeasure links

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